The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Nov. 05, 2015
Applicant:

Taiwan Green Point Enterprises Co., Ltd., Taichung, TW;

Inventors:

Sheng-Hung Yi, Taichung, TW;

Pen-Yi Liao, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/00 (2006.01); H05K 3/00 (2006.01); C23C 18/16 (2006.01); C25D 5/02 (2006.01); H05K 3/18 (2006.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01); C25D 3/46 (2006.01); C25D 3/48 (2006.01); C25D 7/12 (2006.01); C25F 5/00 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); C25D 5/54 (2006.01); C23C 18/20 (2006.01); H05K 3/24 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0026 (2013.01); B23K 26/362 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); C23C 18/1603 (2013.01); C23C 18/1653 (2013.01); C23C 18/1689 (2013.01); C23C 18/2013 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 3/48 (2013.01); C25D 5/02 (2013.01); C25D 5/54 (2013.01); C25D 7/12 (2013.01); C25F 5/00 (2013.01); H05K 3/0041 (2013.01); H05K 3/067 (2013.01); H05K 3/185 (2013.01); H05K 3/4661 (2013.01); B23K 2201/34 (2013.01); B23K 2201/40 (2013.01); B23K 2203/56 (2015.10); H05K 3/027 (2013.01); H05K 3/107 (2013.01); H05K 3/24 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09363 (2013.01); H05K 2203/0392 (2013.01); H05K 2203/107 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure.


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