The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Jul. 18, 2014
Applicant:

Starkey Laboratories, Inc., Eden Prairie, MN (US);

Inventors:

Susie Johansson, Eden Prairie, MN (US);

Andy Lambert, Eden Prairie, MN (US);

Assignee:

Starkey Laboratories, Inc., Eden Prairie, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H04R 25/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H04R 25/60 (2013.01); H05K 1/0281 (2013.01); H05K 1/0393 (2013.01); H05K 3/303 (2013.01); H05K 3/34 (2013.01); H05K 3/363 (2013.01); H05K 1/189 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the first number of conductors, and a first board-to-board connector element connected to at least some of the first number of conductors on a first side of the substrate. The first board-to-board connector element is configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate. The system may further include a stiffener board connected by solder to a second side of the first flexible substrate opposite the board-to-board connector element.


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