The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Aug. 13, 2013
Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Theodore R. Hoelter, Goleta, CA (US);

Joseph Kostrzewa, Buellton, CA (US);

Pierre Boulanger, Goleta, CA (US);

Barbara Sharp, Santa Barbara, CA (US);

Eric A. Kurth, Santa Barbara, CA (US);

Assignee:

FLIR Systems, Inc., Wilsonville, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H04N 5/33 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2252 (2013.01); H04N 5/2257 (2013.01); H04N 5/33 (2013.01);
Abstract

A housing for an infrared camera module may be implemented with a substantially non-metal cover configured to substantially or completely enclose various components of an infrared imaging device. A metal layer may be disposed on various interior and/or exterior surfaces of the cover. Such implementations may be used to reduce the effects of various environmental conditions which may otherwise adversely affect the performance of the infrared imaging device. In addition, one or more conductive traces may be built into the housing and/or on interior surfaces of the housing to facilitate the passing of signals from components of the infrared imaging device such as infrared sensors, read out circuitry, a temperature measurement component, and/or other components. One or more fiducial markers may be provided to align various components of the infrared camera module during manufacture.


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