The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Nov. 16, 2012
Applicant:

Cytec Technology Corp., Wilmington, DE (US);

Inventors:

Yiqiang Zhao, Newark, DE (US);

Dalip Kumar Kohli, Churchville, MD (US);

Kunal Gaurang Shah, Gujarat, IN;

Assignee:

Cytec Technology Corp., Wilmington, DE (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/04 (2006.01); B32B 37/16 (2006.01); H04L 29/06 (2006.01); H04W 12/06 (2009.01); H04W 12/08 (2009.01); H04W 4/00 (2009.01); G06F 9/445 (2006.01); G06F 9/455 (2006.01); G06F 3/0482 (2013.01); G06F 3/0484 (2013.01); H04M 1/725 (2006.01); H04W 76/02 (2009.01); H04L 12/24 (2006.01); H04W 68/12 (2009.01);
U.S. Cl.
CPC ...
H04L 63/0272 (2013.01); B32B 37/16 (2013.01); C09J 7/041 (2013.01); G06F 3/0482 (2013.01); G06F 3/04842 (2013.01); G06F 9/445 (2013.01); G06F 9/455 (2013.01); G06F 9/45558 (2013.01); H04L 41/0853 (2013.01); H04L 63/102 (2013.01); H04L 63/105 (2013.01); H04L 63/20 (2013.01); H04M 1/72522 (2013.01); H04M 1/72583 (2013.01); H04W 4/001 (2013.01); H04W 4/003 (2013.01); H04W 12/06 (2013.01); H04W 12/08 (2013.01); H04W 68/12 (2013.01); H04W 76/02 (2013.01); G06F 2009/45587 (2013.01); G06F 2009/45595 (2013.01); Y10T 428/14 (2015.01);
Abstract

A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.


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