The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Feb. 01, 2013
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Jimmy S. Takeuchi, Mercer Island, WA (US);
Rodney D. Cameron, Des Moines, WA (US);
Peter T. Heisen, Kent, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 13/00 (2006.01); H01Q 1/52 (2006.01); H01Q 1/38 (2006.01); H01Q 3/26 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01P 11/00 (2013.01); H01Q 1/38 (2013.01); H01Q 1/523 (2013.01); H01Q 3/26 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/061 (2013.01); Y10T 29/49016 (2015.01);
Abstract
A method includes coupling a printed circuit board (PCB) and a first conductive sheet to a pressure plate to form an antenna sub-assembly. The first conductive sheet defines a first plurality of openings and includes a first plurality of bumps. At least one opening of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps. The method includes coupling the antenna sub-assembly to a cover to form an antenna assembly.