The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Aug. 01, 2014
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;

Inventors:

Yosuke Tsuchiya, Kiyosu, JP;

Hiroyuki Tajima, Kiyosu, JP;

Shota Shimonishi, Kiyosu, JP;

Shigeo Takeda, Kiyosu, JP;

Tomohiro Miwa, Kiyosu, JP;

Assignee:

TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/16 (2010.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 33/644 (2013.01); H01L 2924/0002 (2013.01); H05K 1/021 (2013.01); H05K 1/0209 (2013.01); H05K 3/284 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element.


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