The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Sep. 10, 2014
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Kyeoung An Jung, Seoul, KR;
Jung Hun Oh, Seoul, KR;
Assignee:
LG Innotek Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); F21V 3/00 (2015.01); F21V 29/00 (2015.01); F21V 3/04 (2006.01); H01L 33/54 (2010.01); F21Y 101/02 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/48 (2013.01); F21V 3/00 (2013.01); F21V 3/0472 (2013.01); F21V 29/22 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); F21Y 2101/02 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01);
Abstract
A light emitting device package includes a package body, and a light emitting device chip provided on a chip mount area of the package body. A molding member is provided on the package body. The package body includes a central area having the chip mount area and a chip non-mount area adjacent to the chip mount area. An upper surface of the light emitting device chip is higher than an upper surface of the package body in the chip non-mount area and an upper surface of the package body in the peripheral area.