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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9472726 B1

PDFFull Text
Date of Patent:
Oct. 18, 2016

Filed:

Jun. 24, 2015

Integrated led light-emitting device and fabrication method thereof

Applicant:

Xiamen Sanan Optoelectronics Technology Co., Ltd., Xiamen, CN;

Inventors:

Shaohua Huang, Xiamen, CN;

Xiaoqiang Zeng, Xiamen, CN;

Chih-Wei Chao, Xiamen, CN;

Assignee:

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD., Xiamen, CN;

Attorneys:

Syncoda LLC

Feng Ma

Junjie Feng

Primary Examiner:

Victor A Mandala

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 27/15 (2006.01); H01L 33/44 (2010.01); H01L 21/78 (2006.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/387 (2013.01); H01L 21/78 (2013.01); H01L 24/14 (2013.01); H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 33/005 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 27/156 (2013.01); H01L 33/382 (2013.01); H01L 33/62 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01);
Abstract

An integrated LED light-emitting device includes: at least two mutually-isolated LED light-emitting epitaxial units having an upper and a lower surface, in which, the upper surface is a light-emitting surface; an electrode pad layer over the lower surface of the LED light-emitting epitaxial unit, with sufficient thickness for supporting the LED epitaxial unit and connecting to each LED light-emitting epitaxial unit to form a connection circuit plane with no height difference; and the electrode pad layer is divided into a P electrode region and an N electrode region. The LED light-emitting epitaxial units constitute a series, parallel or series-parallel circuit. Embodiments disclosed herein can effectively improve the problems of package welding, electrode shading and poor wiring stability.

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