The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Mar. 29, 2012
Applicants:

Tsutomu Matsuura, Chiyoda-ku, JP;

Hiroya Yamarin, Chiyoda-ku, JP;

Hidetada Tokioka, Chiyoda-ku, JP;

Inventors:

Tsutomu Matsuura, Chiyoda-ku, JP;

Hiroya Yamarin, Chiyoda-ku, JP;

Hidetada Tokioka, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/18 (2006.01); H01L 31/068 (2012.01); H01L 31/0747 (2012.01); H01L 31/20 (2006.01); H01L 31/0224 (2006.01); H01L 31/028 (2006.01); H01L 31/042 (2014.01); H01L 31/075 (2012.01); H01L 31/04 (2014.01);
U.S. Cl.
CPC ...
H01L 31/1884 (2013.01); H01L 31/028 (2013.01); H01L 31/022441 (2013.01); H01L 31/04 (2013.01); H01L 31/042 (2013.01); H01L 31/068 (2013.01); H01L 31/0682 (2013.01); H01L 31/075 (2013.01); H01L 31/0747 (2013.01); H01L 31/1804 (2013.01); H01L 31/20 (2013.01); H01L 31/202 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

A back contact heterojunction photoelectric conversion device, that obtain junctions that are nearly ohmic contacts by integrally forming a transparent conductive film including an electrode directly on a p-type amorphous silicon film and a transparent conductive oxide directly on an n-type amorphous silicon film. A method of manufacturing the device includes: integrally forming an oxide electrode layer on the n-type amorphous silicon film and the p-type amorphous silicon film; and applying plasma, under a condition that a mask is disposed on the transparent conductive film covering either the n-type amorphous silicon film or the p-type amorphous silicon film, to exposed portions of transparent conductive film.


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