The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Dec. 09, 2015
Applicant:

The United States of America, As Represented BY the Secretary of the Air Force, Washington, DC (US);

Inventors:

Burhan Bayraktaroglu, Yellow Springs, OH (US);

Kevin D Leedy, Dayton, OH (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/66 (2006.01); H01L 21/324 (2006.01); H01L 21/3065 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66742 (2013.01); H01L 21/3065 (2013.01); H01L 21/324 (2013.01); H01L 21/76897 (2013.01);
Abstract

A method of fabricating a multi-zone, short gate length thin film transistor is provided. Gate metal and a plurality of layers are deposited on a substrate. The layers include a gate insulator, a first semiconductor, a second semiconductor, and source contact metal. An insulator is deposited on the plurality of layers partially overlapping the gate electrode and masking part of the plurality of layers. Portions of the source contact metal not masked by the insulator are removed and the first and second semiconductors are diffused with dopants via a plasma. Sidewalls of the insulator and source metal contact are covered with an insulating layer. Portions of the second semiconductor not masked are removed by etching for a length of time to create undercuts below the insulator and extending under the source contact metal. The undercuts are filled with an insulating material and an external metal contact layer is deposited.


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