The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Mar. 24, 2014
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Kenju Nishikido, Kumamoto, JP;
Kazunori Nagahata, Kumamoto, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); H01L 27/146 (2006.01); H04N 5/378 (2011.01); H04N 5/361 (2011.01); H01L 23/482 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 23/482 (2013.01); H01L 27/14625 (2013.01); H04N 5/335 (2013.01); H04N 5/361 (2013.01); H04N 5/378 (2013.01); H01L 27/1464 (2013.01); H01L 27/14605 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14629 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An solid-state imaging device includes a pixel region formed on a semiconductor substrate, an effective pixel region and a shielded optical black region in the pixel region, a multilayer wiring layer formed on a surface of the side opposite to a light incident side of the semiconductor substrate, a supporting substrate bonded to a surface of the multilayer wiring layer side, and an antireflection structure that is formed on the bonding surface side of the supporting substrate.