The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Jan. 05, 2015
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Toshiya Akamatsu, Zama, JP;
Muneyuki Odaira, Isehara, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/81 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11901 (2013.01); H01L 2224/11903 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/8118 (2013.01); H01L 2224/81141 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/3511 (2013.01);
Abstract
Surfaces of a semiconductor chip and a circuit board are made to face each other, and upper portions of stoppers of the circuit board are fit into regions between adjacent stoppers of rail grooves of the semiconductor chip, and upper portions of the stoppers of the semiconductor chip are fit into regions between the adjacent stoppers of rail grooves of the circuit board, whereby side surfaces of first terminals of the semiconductor chip and side surfaces of second terminals of the circuit board are electrically connected.