The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Oct. 28, 2014
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventors:
Weimin Sun, Santa Rosa Valley, CA (US);
Peter J. Zampardi, Jr., Newbury Park, CA (US);
Hongxiao Shao, Thousand Oaks, CA (US);
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H01L 23/00 (2006.01); C25D 5/02 (2006.01); C25D 5/12 (2006.01); H05K 3/34 (2006.01); C25D 7/06 (2006.01); C25D 17/00 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); C25D 5/022 (2013.01); C25D 5/12 (2013.01); C25D 7/0607 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H05K 3/3452 (2013.01); C25D 17/00 (2013.01); H01L 2223/6605 (2013.01); H01L 2224/03424 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85411 (2013.01); H01L 2224/85416 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/2064 (2013.01); H05K 1/0243 (2013.01); H05K 3/244 (2013.01); H05K 2203/049 (2013.01); H05K 2203/0597 (2013.01);
Abstract
To reduce radio frequency (RF) losses during operation of a radio frequency integrated circuit (RFIC) module, the RFIC module is fabricated such that at least one of an edge of the wirebond pad on the copper trace and a sidewall of the copper trace is free from high-resistivity plating material. The unplated portion provides a path for the RF current to flow around the high-resistivity material, which reduces the RF signal loss associated with the high resistivity plating material.