The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
May. 26, 2014
Applicant:
Zf Friedrichshafen Ag, Friedrichshafen, DE;
Inventor:
Thomas Maier, Neunburg vorm Wald, DE;
Assignee:
ZF FRIEDRICHSHAFEN AG, Friedrichshafen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); F16H 61/00 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); F16H 61/0006 (2013.01); H01L 23/04 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 23/4334 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A circuit device for controlling a transmission of a vehicle comprises an integrated circuit, which is mounted with a first surface on a first support surface of a circuit substrate and on a second surface opposite to the first surface comprises a heat-conducting surface for dissipating heat from the integrated circuit, in particular wherein the heat-conducting surface is designed as a contacting surface for contacting a heat sink.