The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Jul. 18, 2014
Tdk Corporation, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Seiko Komatsu, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle θ. The angle θ is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w. The expression (1) istan(/2)≦θ≦tan(2)