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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9472351 B1

PDFFull Text
Date of Patent:
Oct. 18, 2016

Filed:

Jan. 07, 2015

Solid electrolytic capacitor, electronic component module, method for producing solid electrolytic capacitor and method for producing electronic component module

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-Fu, JP;

Inventors:

Akio Katsube, Nagaokakyo, JP;

Hiroki Kitayama, Nagaokakyo, JP;

Shinji Otani, Nagaokakyo, JP;

Koji Murata, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Hoa C Nguyen

Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 9/15 (2006.01); H01G 9/012 (2006.01); H01G 9/00 (2006.01); H05K 3/34 (2006.01); H01G 9/14 (2006.01); H01G 9/042 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01G 9/15 (2013.01); H01G 9/0032 (2013.01); H01G 9/012 (2013.01); H01G 9/14 (2013.01); H05K 3/3426 (2013.01); H05K 3/3494 (2013.01); H01G 9/042 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); Y02P 70/613 (2015.11); Y10T 29/417 (2015.01); Y10T 29/49144 (2015.01);
Abstract

A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.

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