The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Jul. 15, 2014
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

No Il Park, Suwon-Si, KR;

Seung Wook Park, Suwon-Si, KR;

Chang Bae Lee, Suwon-Si, KR;

Chang Ryul Jung, Suwon-Si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 38/14 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H04B 5/00 (2006.01); H02J 7/02 (2016.01);
U.S. Cl.
CPC ...
H01F 38/14 (2013.01); H01F 5/00 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H04B 5/0037 (2013.01); H04B 5/0075 (2013.01); H02J 7/025 (2013.01); Y10T 29/4902 (2015.01);
Abstract

The present invention relates to a coil type unit for wireless power transmission, a wireless power transmission device, an electronic device, and a manufacturing method of a coil type unit for wireless power transmission. A coil type unit for wireless power transmission of the present invention includes a coil portion having a coil pattern on a substrate; a magnetic portion having the coil portion attached to one surface thereof and a conductive pattern formed thereon; an adhesive portion interposed between the magnetic portion and the coil portion to mutually bond the magnetic portion and the coil portion; and a conductive hole for electrically connecting the coil pattern and the conductive pattern, wherein the adhesive portion is formed on one surface of the magnetic portion having the conductive pattern thereon while being formed in an area other than the area in which the conductive pattern is formed.


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