The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Jan. 13, 2014
Multiphoton Optics Gmbh, Würzburg, DE;
Ruth Houbertz-Krauss, Würzburg, DE;
Markus Riester, Seiersberg, AT;
Multiphoton Optics GmbH, Würzburg, DE;
Abstract
The present invention is directed to a package including optical components, comprising: (i) at least one structure, the structure having at least one optical input or output, (ii) at least one optical interconnection, optically connected to the at least one optical input or output, and (iii) a component in which the at least one optical interconnection and the at least one optical input or output is embedded, wherein (a) the component (iii) embedding the at least one optical interconnection and the at least one optical input or output and the at least one optical interconnection (ii) are made from a chemically identical material, wherein the material of the at least one optical interconnection has a different primary and/or secondary structure, compared to the material of the component embedding the at least one optical interconnection and the at least one optical input or output, (b) the component (iii) embedding the at least one optical interconnection and the at least one optical input or output and the at least one optical interconnection (ii) have a difference in their refractive indices of at least 0.0004 to 0.0015 at 850, 1310, and 1550 nm, respectively, and (c) the at least one optical interconnection (ii) is mechanically fixed by the component (iii) embedding the at least one optical interconnection and the at least one optical input or output. Further, the invention provides methods for the preparation of the said package.