The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Feb. 27, 2013
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Ira Oaktree Wygant, Palo Alto, CA (US);

Peter B. Johnson, Sunnyvale, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/125 (2006.01); H02N 1/00 (2006.01); H04R 19/00 (2006.01); B81B 7/00 (2006.01); H03H 3/007 (2006.01); H03H 9/24 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); B81B 7/007 (2013.01); H02N 1/006 (2013.01); H03H 3/0072 (2013.01); H03H 9/2489 (2013.01); H04R 19/005 (2013.01); B81B 2207/096 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/036 (2013.01); H03H 9/1057 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A packaged capacitive MEMS sensor device includes at least one capacitive MEMS sensor element with at least one capacitive MEMS sensor cell including a first substrate having a thick and a thin dielectric region. A second substrate with a membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a MEMS cavity. The membrane layer provides a fixed electrode and a released MEMS electrode over the MEMS cavity. A first through-substrate via (TSV) extends through a top side of the MEMS electrode and a second TSV through a top side of the fixed electrode. A metal cap is on top of the first TSV and second TSV. A third substrate including an inner cavity and outer protruding portions framing the inner cavity is bonded to the thick dielectric regions. The third substrate together with the first substrate seals the MEMS electrode.


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