The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Sep. 12, 2013
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventors:

Richard A. Davis, Plano, TX (US);

Carl Stewart, Plano, TX (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/06 (2006.01); G01L 9/00 (2006.01); H05K 3/30 (2006.01); G01L 19/00 (2006.01); G01L 19/06 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0052 (2013.01); G01L 19/0007 (2013.01); G01L 19/0038 (2013.01); G01L 19/0061 (2013.01); G01L 19/147 (2013.01); H05K 3/30 (2013.01); G01L 9/0055 (2013.01); G01L 9/0092 (2013.01); G01L 19/0084 (2013.01); G01L 19/0627 (2013.01); G01L 19/0645 (2013.01); G01L 19/148 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49155 (2015.01);
Abstract

A pressure sensor includes a pressure sensing element and a top cap. The pressure sensing element includes a bonded wafer substrate having a buried sealed cavity. A wall of the buried sealed cavity forms a sensing diaphragm. One or more sense elements may be supported by the sensing diaphragm and one or more bond pads are supported by the upper side of the bonded wafer substrate. Each of the bond pads may be positioned adjacent to the sensing diaphragm and electrically connected to one or more of the sense elements. The top cap may be secured to the upper side of the bonded wafer substrate such that an aperture in the top cap facilitates passage of a media in a downward direction to the sensing diaphragm. The top cap may be configured to isolate the bond pads from the media.


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