The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Nov. 24, 2014
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Brian Kinnune, Racine, WI (US);

Dave Goelz, Milwaukee, WI (US);

Assignee:

CREE, INC., Durham, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 5/04 (2006.01); F21V 29/70 (2015.01); F21V 19/00 (2006.01); F21K 99/00 (2016.01); F21V 31/00 (2006.01); B29D 11/00 (2006.01); F21Y 101/02 (2006.01); B29K 101/12 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
F21V 5/04 (2013.01); B29D 11/0073 (2013.01); F21K 9/90 (2013.01); F21V 19/001 (2013.01); F21V 29/70 (2015.01); F21V 31/005 (2013.01); B29K 2101/12 (2013.01); B29K 2105/253 (2013.01); B29K 2995/0003 (2013.01); B29K 2995/0036 (2013.01); F21Y 2101/02 (2013.01);
Abstract

An LED light fixture including a mounting surface which supports a circuit board with at least one LED light source spaced thereon, and an optical member which has a back side having a groove facing the mounting surface and surrounding the circuit board. The groove is filled with a resilient in-situ-formed compressible gasket material sealingly engaged with the mounting surface to environmentally seal the circuit board. The mounting surface may be of a heat-sink structure. The in-situ-formed gasket has an inner edge and a plurality of inward projections spaced therealong. Each inward projection extends inwardly to a position facing the circuit board and presses the circuit board against the mounting surface, thereby facilitating heat transfer away from the circuit board.


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