The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Jan. 20, 2015
Applicant:

Ii-vi Incorporated, Saxonburg, PA (US);

Inventors:

Wen-Qing Xu, Medfield, MA (US);

Elgin E. Eissler, Renfrew, PA (US);

Chao Liu, Butler, PA (US);

Charles D. Tanner, Saxonburg, PA (US);

Charles J. Kraisinger, Saxonburg, PA (US);

Michael Aghajanian, Newark, DE (US);

Assignee:

II-VI Incorporated, Saxonburg, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/02 (2006.01); C30B 25/02 (2006.01); C04B 35/52 (2006.01); C04B 41/85 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01); C23C 16/27 (2006.01); C23C 16/46 (2006.01); C23C 16/56 (2006.01); C23C 28/04 (2006.01); C01B 31/06 (2006.01); C04B 35/565 (2006.01); C04B 35/573 (2006.01); C04B 35/634 (2006.01);
U.S. Cl.
CPC ...
C30B 25/02 (2013.01); C01B 31/06 (2013.01); C04B 35/52 (2013.01); C04B 35/565 (2013.01); C04B 35/573 (2013.01); C04B 35/634 (2013.01); C04B 41/009 (2013.01); C04B 41/5002 (2013.01); C04B 41/85 (2013.01); C23C 16/274 (2013.01); C23C 16/279 (2013.01); C23C 16/463 (2013.01); C23C 16/56 (2013.01); C23C 28/04 (2013.01); C23C 28/046 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/427 (2013.01); C04B 2235/5427 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/602 (2013.01); C04B 2235/604 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); Y10T 428/21 (2015.01); Y10T 428/24355 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24893 (2015.01); Y10T 428/26 (2015.01); Y10T 428/265 (2015.01); Y10T 428/30 (2015.01);
Abstract

A multilayer substrate includes a diamond layer CVD grown on a composite layer. The composite layer includes particles of diamond and silicon carbide and, optionally, silicon. A loading level (by volume) of diamond in the composite layer can be ≧5%; ≧20%; ≧40%; or ≧60%. The multilayer substrate can be used as an optical device; a detector for detecting radiation particles or electromagnetic waves; a device for cutting, drilling, machining, milling, lapping, polishing, coating, bonding, or brazing; a braking device; a seal; a heat conductor; an electromagnetic wave conductor; a chemically inert device for use in a corrosive environment, a strong oxidizing environment, or a strong reducing environment, at an elevated temperature, or under a cryogenic condition; or a device for polishing or planarization of other devices, wafers or films.


Find Patent Forward Citations

Loading…