The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Jan. 31, 2011
Applicants:
Xiaomin Yang, Livermore, CA (US);
Wei HU, Newark, CA (US);
Zhaoning Yu, Palo Alto, CA (US);
Justin Jia-jen Hwu, Fremont, CA (US);
Kim Yang Lee, Fremont, CA (US);
Inventors:
XiaoMin Yang, Livermore, CA (US);
Wei Hu, Newark, CA (US);
Zhaoning Yu, Palo Alto, CA (US);
Justin Jia-Jen Hwu, Fremont, CA (US);
Kim Yang Lee, Fremont, CA (US);
Assignee:
Seagate Technology LLC, Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); G03F 7/00 (2006.01); G03F 7/16 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
B81C 1/00031 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); G03F 7/165 (2013.01); B81C 2201/0149 (2013.01); Y10T 428/24479 (2015.01);
Abstract
A method of self-assembling density multiplied block copolymers (BCP) structures includes applying a block copolymer (BCP) to a feature-imprinted resist layer. The BCP is thermally annealed to laterally segregate the BCP into self-assembled columns of a first polymer block surrounded by a second polymer block.