The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Sep. 12, 2012
Applicants:
Toshiyuki Miyasaka, Matsumoto, JP;
Yuta Tamai, Matsumoto, JP;
Inventors:
Toshiyuki Miyasaka, Matsumoto, JP;
Yuta Tamai, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/047 (2006.01); B23K 26/20 (2014.01); H01L 25/18 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/24 (2006.01); H01L 25/07 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
B23K 26/20 (2013.01); H01L 21/50 (2013.01); H01L 23/047 (2013.01); H01L 23/49568 (2013.01); H01L 25/18 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 25/072 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40101 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/84214 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15788 (2013.01);
Abstract
A method for producing a semiconductor device includes laser welding to bond an upper terminal and a lower terminal as internal wiring members of the semiconductor device. When the upper terminal is fixed to the lower terminal by the laser welding, a gap between an upper surface of the lower terminal and a lower surface of the upper terminal is equal to or more than 20 μm and equal to or less than 400 μm.