The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Jan. 23, 2014
Applicant:

Eiji Tanaka, Kanazawa, JP;

Inventor:

Eiji Tanaka, Kanazawa, JP;

Assignee:

SHIBUYA KOGYO CO., LTD., Kanazawa-shi, Ishikawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/06 (2014.01); H05K 3/30 (2006.01); H01L 23/00 (2006.01); B23K 26/08 (2014.01);
U.S. Cl.
CPC ...
H05K 3/303 (2013.01); B23K 26/06 (2013.01); B23K 26/0853 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/81224 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); Y10T 29/53178 (2015.01);
Abstract

A bonding systemincludes a plurality of laser resonatorsand a plurality of optical fibers fto feach having a laser beam inlet connected to one of the plurality of laser resonators. The optical fibers are bundled, and laser beam outlets of the optical fibers are disposed so as to optically face a heating region S of an electronic component, and the heating region is irradiated with spots of laser beams emitted from the laser beam outlets. The heating region S is divided into at least corner sub-regions Sat the corners of the electronic component and an inner sub-region Sinside the electronic component, and the laser power of the laser resonators whose laser beam outlets face the corner sub-regions is set higher than the laser power of the laser resonators whose laser beam outlets face the inner sub-region.


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