The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Dec. 28, 2015
Industrial Technology Research Institute, Hsinchu, TW;
Yu-Ming Wang, Taichung, TW;
Sheng-Yu Lin, Miaoli County, TW;
Kai-Jiun Wang, Changhua County, TW;
Wei-Yuan Chen, Taichung, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A manufacturing method of multilayer wiring is provided, wherein a multilayer wiring structure including a wiring layer and a conductive via is formed on a substrate. The wiring layer is formed by forming a patterned colloidal layer having a first catalyzer on the substrate, activating the first catalyzer, and forming a conductive layer on a surface of the patterned colloidal layer. The conductive via is formed by forming an insulation colloidal layer containing a second catalyzer on the substrate and the conductive layer and forming at least one opening in the colloidal insulation layer by laser to expose the conductive layer and activate a portion of the second catalyzer. Electroless plating is performed on the activated second catalyzer to form the conductive via in the opening. An interface is between the patterned colloidal layer and the conductive layer in the multilayer wiring structure.