The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
May. 20, 2015
Applicant:
Japan Display Inc., Tokyo, JP;
Inventors:
Hirotsugu Sakamoto, Tokyo, JP;
Masakazu Gunji, Tokyo, JP;
Assignee:
Japan Display Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/56 (2006.01); C03C 15/02 (2006.01); C03B 33/02 (2006.01); H01L 51/52 (2006.01); B28D 5/00 (2006.01); C03B 33/033 (2006.01); C03B 33/07 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); B28D 5/0011 (2013.01); C03B 33/02 (2013.01); C03B 33/033 (2013.01); C03B 33/076 (2013.01); C03C 15/02 (2013.01); G02F 1/133351 (2013.01); H01L 51/5246 (2013.01); H01L 2251/566 (2013.01); Y02P 40/57 (2015.11);
Abstract
A method of manufacturing a display device includes preparing a multilayout display panel which has a structure of a first substrate and a second substrate which are bonded to each other and is able to be cut into a plurality of products, scribing the first substrate, bending and breaking the scribed first substrate, performing thinning on the second substrate and the broken first substrate by chemical polishing, scribing the second substrate which is subjected to chemical polishing, and bending and breaking the scribed second substrate.