The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Sep. 11, 2014
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Yawei Liu, Guangdong, CN;

Yifan Wang, Guangdong, CN;

Changcheng Lo, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 23/544 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); H01L 23/544 (2013.01); H01L 27/3244 (2013.01); H01L 51/5259 (2013.01); H01L 51/56 (2013.01); H01L 2223/54426 (2013.01); H01L 2227/323 (2013.01); H01L 2251/303 (2013.01); H01L 2251/558 (2013.01);
Abstract

The present invention provides an OLED packaging method and structure. The method includes the following steps: providing an OLED substrate () and a package cover () and forming an alignment mark on the package cover (); forming a circle of patternized desiccant layer () on the package cover (); coating a circle of frame resin () on the package cover () at an outer side of the desiccant layer (); attaching the package cover () and the OLED substrate () to each other; and subjecting the frame resin () to irradiation of a UV light source or heating for curing so as to complete packaging of the OLED substrate () with he package cover ().


Find Patent Forward Citations

Loading…