The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9466632 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 11, 2016

Filed:

Jan. 09, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventor:

Ok-Gyeong Park, Yeongdeok-gun, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01);
Abstract

Disclosed are an image sensor package and an image sensor module having the same. A diffusion resistor is provided on a circuit board for preventing liquid drop diffusion when the liquid drop is compressed. An image sensor chip is mounted on the circuit board such that a central portion of the image sensor chip is positioned on the diffusion resistor of the circuit board. A bonding member is interposed between the circuit board and the image sensor chip around the diffusion resistor such that a bonding area of the image sensor chip is smaller than a surface area of a bonding face of the image sensor chip. Warpage characteristics of the image sensor package are improved by the diffusion resistor.


Find Patent Forward Citations

Park, Ok-Gyeong. (2016). Image sensor package and an image sensor module having the same (U.S. Patent No. 9466632). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9466632

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