The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Mar. 18, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Kwang Soo Kim, Suwon-Si, KR;
Young Hoon Kwak, Suwon-Si, KR;
Chang Seob Hong, Suwon-Si, KR;
Joon Seok Chae, Suwon-Si, KR;
Kee Ju Um, Suwon-Si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/552 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49111 (2013.01);
Abstract
There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil.