The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Jul. 20, 2015
Rohm Co., Ltd., Kyoto, JP;
Tadahiro Morifuji, Kyoto, JP;
Shigeyuki Ueda, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A semiconductor chip includes an electrode pad on a substrate, a barrier metal layer on the electrode pad, a bump electrode, a first protection layer formed on the substrate, and a second protection layer having an opening. The first protection layer overlaps part of the electrode pad. The second protection layer covers a region over the first protection layer and a region over the electrode pad. The upper surface of the second protection layer has an arc surface. The thickness between the arc surface and the electrode pad as seen in a sectional view is gradually large from the rim of the opening to the rim of the electrode pad. The rate of change of the thickness is higher at the rim of the opening than at the rim of the electrode pad.