The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Jul. 17, 2008
Applicants:

Hendrik Pieter Hochstenbach, Nijmegen, NL;

Willem Dirk Van Driel, Den Bosch, NL;

Inventors:

Hendrik Pieter Hochstenbach, Nijmegen, NL;

Willem Dirk Van Driel, Den Bosch, NL;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/3192 (2013.01); H01L 23/522 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/351 (2013.01);
Abstract

The present application relates to a reinforcing structure for reinforcing a stack of layers in a semiconductor component, wherein at least one reinforcing element having at least one integrated anchor-like part, is provided. The basic idea is to reinforce bond pad structures by providing a better mechanical connection between the layers below an advanced underbump metallization (BUMA, UBM) by providing reinforcing elements under the UBM and/or BUMA layer.


Find Patent Forward Citations

Hochstenbach, Hendrik. (2016). Reinforced structure for a stack of layers in a semiconductor component (U.S. Patent No. 9466579). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9466579

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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