The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Feb. 22, 2012
Ken Sakamoto, Tokyo, JP;
Taketoshi Shikano, Tokyo, JP;
Taishi Sasaki, Fukuoka, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device incorporating a heat spreader and improved to inhibit dielectric breakdown is provided. The semiconductor device has an electrically conductive heat spreader having a bottom surface, a sheet member having a front surface and a back surface electrically insulated from each other, IGBTs and diodes fixed on the heat spreader and electrically connected thereto, and a molding resin. The front surface contacts with the bottom surface and has a peripheral portion jutting out from edges thereof. The molding resin encapsulates the front surface of the sheet member, the heat spreader and the semiconductor elements. At least part of the back surface of the sheet member is exposed out of the molding resin. The heat spreader has, at a corner of its bottom surface, corner portions having a beveled shape or a curved-surface shape as seen in plan and having a rectangular shape as seen in section.