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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9466509 B1

PDFFull Text
Date of Patent:
Oct. 11, 2016

Filed:

May. 18, 2015

Semiconductor device manufacturing method

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Kazunaga Onishi, Matsumoto, JP;

Rikihiro Maruyama, Matsumoto, JP;

Masafumi Tezuka, Matsumoto, JP;

Masahiro Kikuchi, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Long Pham

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/057 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/057 (2013.01); H01L 23/544 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 23/24 (2013.01); H01L 23/49861 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A method of manufacturing a semiconductor device, includes preparing a molding die for molding a resin case for a semiconductor device, the molding die having protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position; conforming and holding each of the plurality of terminals to the corresponding protrusions in the molding die; and injecting resin into the molding die to integrally mold the plurality of terminals and the resin case.

Find Patent Forward Citations

Onishi, Kazunaga. (2016). Semiconductor device manufacturing method (U.S. Patent No. 9466509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9466509

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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