The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Oct. 17, 2014
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Jim Tom Belesiu, Mill Creek, WA (US);

Timothy C. Shaw, Sammamish, WA (US);

David Otto Whitt, III, Sammamish, WA (US);

Rob Huala, Bellevue, WA (US);

Christopher Harry Stoumbos, Sammamish, WA (US);

Joel Lawrence Pelley, Bellevue, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H01H 13/79 (2006.01); H01H 13/78 (2006.01); H01H 13/785 (2006.01); G06F 3/02 (2006.01); H05K 5/02 (2006.01); H04M 1/02 (2006.01); H04M 1/725 (2006.01); G05B 11/01 (2006.01); G06F 3/041 (2006.01); H01H 13/704 (2006.01); H01H 13/82 (2006.01); G06F 3/00 (2006.01); G06F 3/01 (2006.01); H01H 13/702 (2006.01); H01H 13/14 (2006.01); H01H 13/703 (2006.01); G06F 9/54 (2006.01); G06F 11/30 (2006.01); G06F 13/10 (2006.01); G06F 3/023 (2006.01); G06F 3/0488 (2013.01); G06F 3/0487 (2013.01); H01H 13/807 (2006.01); H01H 11/00 (2006.01); E05D 11/10 (2006.01); E05F 5/08 (2006.01); F16M 11/38 (2006.01); H01H 9/26 (2006.01);
U.S. Cl.
CPC ...
G06F 1/166 (2013.01); E05D 11/1064 (2013.01); E05F 5/08 (2013.01); F16M 11/38 (2013.01); G05B 11/01 (2013.01); G06F 1/1618 (2013.01); G06F 1/1637 (2013.01); G06F 1/1654 (2013.01); G06F 1/1656 (2013.01); G06F 1/1662 (2013.01); G06F 1/1669 (2013.01); G06F 1/1681 (2013.01); G06F 1/1683 (2013.01); G06F 1/1684 (2013.01); G06F 1/1686 (2013.01); G06F 3/002 (2013.01); G06F 3/01 (2013.01); G06F 3/0202 (2013.01); G06F 3/023 (2013.01); G06F 3/0414 (2013.01); G06F 3/0416 (2013.01); G06F 3/0487 (2013.01); G06F 3/0488 (2013.01); G06F 9/541 (2013.01); G06F 11/3089 (2013.01); G06F 13/102 (2013.01); H01H 11/00 (2013.01); H01H 13/14 (2013.01); H01H 13/702 (2013.01); H01H 13/703 (2013.01); H01H 13/704 (2013.01); H01H 13/78 (2013.01); H01H 13/785 (2013.01); H01H 13/79 (2013.01); H01H 13/807 (2013.01); H01H 13/82 (2013.01); H04M 1/0216 (2013.01); H04M 1/0254 (2013.01); H04M 1/72527 (2013.01); H05K 5/0226 (2013.01); H05K 5/0234 (2013.01); H01H 9/26 (2013.01); H01H 2201/036 (2013.01); H01H 2203/02 (2013.01); H01H 2205/006 (2013.01); H01H 2211/004 (2013.01); H01H 2211/006 (2013.01); H01H 2213/016 (2013.01); H01H 2217/004 (2013.01); H01H 2217/01 (2013.01); H04M 1/0245 (2013.01); Y02B 60/1228 (2013.01); Y10T 16/5401 (2015.01); Y10T 16/551 (2015.01); Y10T 29/49826 (2015.01);
Abstract

Input device layer and nesting techniques are described. In one or more implementations, an input device includes a pressure sensitive key assembly including a substrate having a plurality of hardware elements secured to a surface. The input device also includes one or more layers disposed proximal to the surface, the one or more layers having respective openings configured to nest the one or more hardware elements therein.


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