The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

May. 15, 2014
Applicant:

Amazon Technologies, Inc., Reno, NV (US);

Assignee:

Amazon Technologies, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01); G02B 1/06 (2006.01); G09G 3/28 (2013.01); G09G 3/34 (2006.01); B29C 65/48 (2006.01); G02F 1/167 (2006.01); G02B 5/30 (2006.01); H01M 10/0525 (2010.01); G02F 1/1339 (2006.01); G02B 5/02 (2006.01); G02F 1/155 (2006.01); H01M 2/14 (2006.01);
U.S. Cl.
CPC ...
G02B 26/005 (2013.01); B29C 65/4845 (2013.01); B29C 65/4885 (2013.01); G02B 5/0242 (2013.01); G02B 5/3058 (2013.01); G02B 26/004 (2013.01); G02B 2207/115 (2013.01); G02F 1/1339 (2013.01); G02F 1/155 (2013.01); G02F 1/167 (2013.01); G02F 2001/1678 (2013.01); G02F 2202/36 (2013.01); H01M 2/145 (2013.01); H01M 10/0525 (2013.01);
Abstract

Subject matter disclosed herein relates to improving a contact diameter of an adhesive/sealing material on surfaces of substrates by altering rheological properties of the adhesive/sealing material. An electrowetting display device comprises a first substrate and a second substrate, a first fluid and a second fluid disposed between the first substrate and the second substrate, wherein the first fluid is immiscible with the second fluid. An adhesive/sealing material comprising UV curable epoxy glue is in contact with the second fluid and couples the second substrate to the first substrate. The adhesive/sealing material further comprises silica particles in a range of 1-6% mass fraction of silica that alter rheological properties of the UV curable epoxy glue.


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