The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Apr. 10, 2013
Applicant:
James B. Colvin, Newark, CA (US);
Inventor:
James B. Colvin, Newark, CA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/44 (2006.01); H01L 21/66 (2006.01); B23C 3/00 (2006.01); B24B 37/013 (2012.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/44 (2013.01); B23C 3/00 (2013.01); B24B 37/013 (2013.01); G01R 31/2898 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); Y10T 409/303864 (2015.01);
Abstract
A method and apparatus for preparing electronic samples for a subsequent treatment, e.g., application of a failure analysis treatment. In one embodiment, an electronic device is mounted on a thermally controlled plate and a select temperature is applied thereto. While maintaining the select temperature applied to the thermally controlled plate, a sample preparation process is performed on the electronic device, such as, e.g., performing polishing, thinning, milling, lapping or extracting one or more semiconductor dies that form the electronic device.