The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Oct. 07, 2014
Applicant:

Seiko Epson Corporation, Shinjuku-ku, JP;

Inventors:

Yasuo Inaoka, Shiojiri, JP;

Jun Kakizaki, Sakata, JP;

Yuma Fukuzawa, Matsumoto, JP;

Shunsuke Watanabe, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B32B 37/18 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B32B 37/18 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01);
Abstract

Disclosed is a method of manufacturing a liquid ejecting head where first and second members with different sizes which are formed of silicon are laminated with an adhesive agent. The method includes measuring a distance between a reference point which is positionally aligned in the laminating direction with respect to an imaging unit and a surface which extends from the bonding surface of the second member, and imaging the bonding surface by calculating a focal point distance of the imaging unit based on the distance which is measured and a distance between the imaging unit and the reference point.


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