The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Mar. 15, 2013
Toray Industries, Inc., Tokyo, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Toshihide Sekido, Otsu, JP;
Kazuaki Kitaoka, Ehime, JP;
Hiroshi Odani, Ehime, JP;
Shigeru Nishiyama, Nagoya, JP;
Masahiko Shimizu, Nagoya, JP;
Toray Industries, Inc., , JP;
Abstract
A method of RTM molding includes placing a reinforcing fiber substrate in a mold, placing resin distribution media exhibiting a resin flow resistance lower than a resin flow resistance of said reinforcing fiber substrate on both surfaces of said reinforcing fiber substrate, and after pressure in said mold is reduced by evacuation, injecting a resin into said mold through said resin distribution media to impregnate said reinforcing fiber substrate with said resin injected, wherein resin flow resistance of a first resin distribution medium placed on a first surface of said reinforcing fiber substrate is lower than resin flow resistance of a second resin distribution medium placed on a second surface of said reinforcing fiber substrate, and said evacuation is carried out through said second resin distribution medium while said resin is injected into said first resin distribution medium to impregnate said reinforcing fiber substrate with said resin injected.