The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Oct. 05, 2015
Applicant:
Sandia Corporation, Albuquerque, NM (US);
Inventors:
Timothy J. Boyle, Albuquerque, NM (US);
Ping Lu, Albuquerque, NM (US);
Paul T. Vianco, Albuquerque, NM (US);
Michael E. Chandross, Albuquerque, NM (US);
Assignee:
Sandia Corporation, Albuquerque, NM (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B32B 15/01 (2006.01); B23K 35/30 (2006.01); B23K 35/365 (2006.01); B23K 35/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/365 (2013.01); B23K 35/404 (2013.01); B32B 15/01 (2013.01); B32B 15/018 (2013.01);
Abstract
A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell 'glued' around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C.