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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9463451 B1

PDFFull Text
Expired
Date of Patent:
Oct. 11, 2016

Filed:

Mar. 04, 2014

Ligand, metal complex containing ligand, and reaction using metal complex containing ligand

Applicant:

National University Corporation Nagoya University, Nagoya-shi, JP;

Inventors:

Susumu Saito, Nagoya, JP;

Ryoji Noyori, Nagoya, JP;

Takashi Miura, Nagoya, JP;

Masayuki Naruto, Nagoya, JP;

Kazuki Iida, Nagoya, JP;

Yuki Takada, Nagoya, JP;

Katsuaki Toda, Nagoya, JP;

Sota Nimura, Nagoya, JP;

Santosh Agrawal, Nagoya, JP;

Sunkook Lee, Nagoya, JP;

Assignee:

National University Corporation Nagoya University, Nagoya-shi, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Charanjit Aulakh

Int. Cl.
CPC ...
C07F 15/00 (2006.01); C07F 9/28 (2006.01); B01J 31/28 (2006.01); B01J 31/24 (2006.01); C07C 29/145 (2006.01); C07C 29/149 (2006.01); C07F 9/6561 (2006.01); C07C 209/50 (2006.01); C07C 213/02 (2006.01); C07F 9/58 (2006.01); C07F 15/02 (2006.01); C07F 15/04 (2006.01); C07F 15/06 (2006.01); C07C 29/132 (2006.01); C07C 67/28 (2006.01); C07C 213/00 (2006.01); C07D 207/33 (2006.01);
U.S. Cl.
CPC ...
B01J 31/2414 (2013.01); B01J 31/24 (2013.01); C07C 29/132 (2013.01); C07C 29/145 (2013.01); C07C 29/149 (2013.01); C07C 67/28 (2013.01); C07C 209/50 (2013.01); C07C 213/00 (2013.01); C07C 213/02 (2013.01); C07D 207/33 (2013.01); C07F 9/582 (2013.01); C07F 9/6561 (2013.01); C07F 15/004 (2013.01); C07F 15/008 (2013.01); C07F 15/0053 (2013.01); C07F 15/0066 (2013.01); C07F 15/0093 (2013.01); C07F 15/025 (2013.01); C07F 15/045 (2013.01); C07F 15/065 (2013.01); B01J 2231/641 (2013.01); B01J 2231/76 (2013.01); B01J 2531/821 (2013.01); B01J 2531/822 (2013.01); B01J 2531/827 (2013.01); B01J 2531/828 (2013.01); B01J 2531/842 (2013.01); B01J 2531/845 (2013.01); B01J 2531/847 (2013.01);
Abstract

A hydrogen transfer reaction may be more efficiently promoted by using a metal complex represented by Formula (2): More specifically, the metal complex enables a hydrogenation reaction of various substrates having a stable carbonyl group or the like to be advanced with a high yield under mild conditions.

Find Patent Forward Citations

Saito, Susumu. (2016). Ligand, metal complex containing ligand, and reaction using metal complex containing ligand (U.S. Patent No. 9463451). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9463451

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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