The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
May. 15, 2013
Dimicron, Inc, Orem, UT (US);
Clayton F Gardinier, Lafayette, LA (US);
Alfred S Despres, Heber, UT (US);
Troy J Medford, Orem, UT (US);
Tim Bunton, Norfolk, VA (US);
DIMICRON, INC., Orem, UT (US);
Abstract
Polycrystalline diamond compacts for use in artificial joints achieve reduced corrosion and improved biocompatibility through the use of solvent metal formulations containing tin and through the control of solvent metal pore size, particularly in inner layers of the compact. Solvent metal formulations containing tin have been discovered which provide sintering ability, part strength, and grind resistance comparable to levels achieved by using CoCrMo solvent metals. It has been discovered that limiting the solvent metal pore size in the diamond layers minimizes or eliminates the occurrence of micro cracks in the solvent metal and significantly reduces the corrosion of the compact as manifested by the release of heavy metal ions from the compact. Polycrystalline diamond compacts which utilize both the solvent metal formulations containing tin and the control of pore sizes achieve significantly reduced corrosion and improved biocompatibility compared to prior art polycrystalline diamond compacts.