The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Dec. 15, 2014
Huawei Technologies Co., Ltd., Shenzhen, CN;
Huawei Technologies Co., Ltd., Shenzhen, CN;
Abstract
A heat sink, including a heat sink body and a filling material. A through hole is disposed in a position, corresponding to a to-be-cooled electronic element, on the heat sink body. The to-be-cooled electronic element is mounted on a circuit board and located between the circuit board and the heat sink body. There is a gap between the to-be-cooled electronic element and the heat sink body. The gap is connected to the through hole. The filling material is injected into the through hole and fills the gap. The present invention further discloses a heat dissipation system having the heat sink. The heat sink resolves problems in the prior art that, a heat sink has low thermal conduction efficiency and it is difficult to control a filling volume of a thermally conductive material in a gap between a heat sink and a chip.