The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

Jul. 24, 2014
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Yuuki Takemoto, Kariya, JP;

Katsutoyo Misawa, Kariya, JP;

Yuuichi Handa, Anjo, JP;

Syotarou Yamasaki, Kariya, JP;

Syuji Kurauchi, Nagoya, JP;

Kenta Hatakenaka, Obu, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H02M 3/00 (2006.01); H02M 3/335 (2006.01); B60L 11/00 (2006.01); H02M 3/337 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H02M 3/33507 (2013.01); B60L 11/00 (2013.01); H01F 5/00 (2013.01); H02M 3/00 (2013.01); H02M 3/337 (2013.01); H05K 1/18 (2013.01); H05K 1/0263 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10515 (2013.01);
Abstract

An electric power source device has a transformer, a primary-side semiconductor module, a secondary-side semiconductor module, a secondary-side electrical component, a base plate and a circuit substrate on which substrate-side electrical components are mounted. The primary-side semiconductor module has a larger exterior size than the secondary-side electrical component. The primary-side semiconductor module and the secondary-side electrical component form a stacked section. In the stacked section, the secondary-side electrical component is stacked, in a vertical direction, i.e. a direction of a normal line of a mounting surface of the base plate, on the primary-side semiconductor module. The primary-side semiconductor module is directly mounted on the mounting surface. At least a part of the substrate-side electrical components is arranged inside of the primary-side semiconductor module in a horizontal direction, and inside of a second surface of the stacked section toward the mounting surface along the normal line.


Find Patent Forward Citations

Loading…