The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

Feb. 20, 2013
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Stefan Illek, Donaustauf, DE;

Matthias Sabathil, Regensburg, DE;

Alexander Linkov, Regensburg, DE;

Thomas Bleicher, Regensburg, DE;

Norwin von Malm, Nittendorf, DE;

Wolfgang Mönch, Pentling, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); G02F 1/1335 (2006.01); H01L 33/44 (2010.01); H01L 33/54 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01); F21Y 101/02 (2006.01); F21Y 105/00 (2016.01); F21V 8/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); G02F 1/133603 (2013.01); G02F 1/133606 (2013.01); H01L 25/0753 (2013.01); H01L 33/44 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/644 (2013.01); F21Y 2101/02 (2013.01); F21Y 2105/00 (2013.01); G02B 6/0015 (2013.01); G02B 6/0018 (2013.01); G02B 6/0025 (2013.01); G02F 1/133605 (2013.01); G02F 1/133611 (2013.01); G02F 1/133615 (2013.01); G02F 2001/133607 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0091 (2013.01);
Abstract

In at least one embodiment, a surface light source includes one or a more optoelectronic semiconductor chips having a radiation main side for generating a primary radiation. A scattering body is disposed downstream of the radiation main side along a main emission direction of the semiconductor chips. The scatting body is designed for scattering the primary radiation. A main emission direction of the scattering body is oriented obliquely with respect to the main emission direction of the semiconductor chip.


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