The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Sep. 22, 2014
Applicant:
Optiz, Inc., Palo Alto, CA (US);
Inventors:
Vage Oganesian, Sunnyvale, CA (US);
Zhenhua Lu, East Palo Alto, CA (US);
Assignee:
OPTIZ, INC., Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 31/024 (2014.01); H01L 31/02 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 31/024 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 31/02005 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01);
Abstract
A sensor device and method of making same that includes a silicon substrate with opposing first and second surfaces, a sensor formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor, and a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface. The cooling channels instead can be formed on one or more separate substrates that are attached to the silicon substrate for cooling the silicon substrate.