The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Apr. 08, 2014
Boe Technology Group Co., Ltd., Beijing, CN;
Beijing Boe Display Technology Co., Ltd., Beijing, CN;
Jinchao Bai, Beijing, CN;
Yao Liu, Beijing, CN;
Liangliang Li, Beijing, CN;
Xiangqian Ding, Beijing, CN;
Zongjie Guo, Beijing, CN;
Abstract
According to the method for manufacturing an array substrate of the present disclosure, when two non-adjacent conductive layers are electrically connected to each other through the via-holes, the insulating layers between the adjacent conductive layers may be etched by several etching processes so as to form the corresponding via-holes in the insulating layer, thereby to achieve the electrical connection between the non-adjacent conductive layers. Meanwhile, it is also able to achieve the electrical connection between the adjacent conductive layers through the via-holes in each etching process. In other words, when at least three conductive layers are electrically connected with each other through the via-holes, merely the insulating layer between the adjacent conductive layers is etched in each etching process.