The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
May. 07, 2015
Applicant:
Ps4 Luxco S.a.r.l., Luxembourg, LU;
Inventor:
Kazuma Shimamoto, Tokyo, JP;
Assignee:
PS4 Luxco S.a.r.l., Luxembourg, LU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 23/535 (2006.01); H01L 29/16 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10814 (2013.01); H01L 23/535 (2013.01); H01L 27/10823 (2013.01); H01L 27/10855 (2013.01); H01L 27/10876 (2013.01); H01L 29/16 (2013.01); H01L 29/7827 (2013.01); H01L 27/10885 (2013.01); H01L 27/10891 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Provided is a semiconductor device including first and second semiconductor pillars formed on a surface of a semiconductor substrate and aligning in a first direction; a first interconnect extending in a second direction intersecting with the first direction and provided between the first and second semiconductor pillars; and a first contact pad located over the first interconnect, the first contact pad being in contact with and electrically connected to the first semiconductor pillar at a side surface thereof, while being electrically isolated from the second semiconductor pillar.