The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Feb. 11, 2016
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/3675 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 23/562 (2013.01); H05K 2201/10166 (2013.01);
Abstract
A heat dissipating circuit board for a power semiconductor includes an electrode material on which a power semiconductor is mounted on a front surface thereof, and a member bonded to a front surface side of the electrode material. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.