The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Aug. 21, 2013
Kabushiki Kaisha Meiki Seisakusho, Ohbu-shi, Aichi, JP;
Tomoaki Hirose, Ohbu, JP;
Atsushi Okano, Nagoya, JP;
Hisanaga Tajima, Inazawa, JP;
Takayuki Yamamoto, Tokoname, JP;
KABUSHIKI KAISHA MEIKI SEISAKUSHO, Ohbu-Shi, JP;
Abstract
To provide a lamination method and a lamination system capable of excellently laminating a film-type laminate without damage even though the semiconductor is a brittle lamination target such as a foil-type semiconductor or a semiconductor made of highly brittle material. In a lamination method for laminating a film-type laminate to a brittle lamination target by overlapping the brittle lamination target and the film-type laminate and heating and pressing the brittle lamination target and the film-type laminate, with respect to the brittle lamination target mounted on a mount member and carried into a lamination device, an elastic film member is expanded into a vacuum chamber of the lamination device from the above to press and laminate the brittle lamination target and the film-type laminate.